热门站点| 世界资料网 | 专利资料网 | 世界资料网论坛
收藏本站| 设为首页| 首页

16 Fiber grating pressure sensor with enhanced sensitivity

作者:科技文献资料网 时间:2018-01-21 01:05:35  浏览:8875   来源:科技文献资料网
下载地址: 点击此处下载
[唯一标识符]:CDSTIC.SPIE.5623-003
[文献来源]:国际光学工程学会数据库
[文献类型]:科技会议
[标题]:16 Fiber grating pressure sensor with enhanced sensitivity
[作者]:"Lihui Liu, Qida Zhao, Weigang Zhang, Hao Zhang, Long Jin, Luming Zhao, Yu Yan, Shiyu Gao, Xiaoyi Dong "
[文摘]:" A novel pressure sensor with FBG partly packaged by a metal tube is presented. The thermal-strain cross effect can be avoided. Moreover, its pressure sensitivity is -2.44?0-3/MPa with the range from 0 to 0.44 MPa, which is 1200 times as that of a bare
[卷]:5623
[ISBN]:0-8194-5577-6
[会议名称]:Passive Components and Fiber-based Devices
[会议时间]:Jan 2005
[会议信息]:"Editor(s): Yan Sun, Shuisheng Jian, Sang Bae Lee, Katsunari Okamoto "; ISBN 0-8194-5577-6; Publication Date: Jan 2005; 1090 pages; 140 papers;
[馆藏索取号]:X-34606
[总页数]:4


下载地址: 点击此处下载
[唯一标识符]:CDSTIC.ISTP.1106263
[文献来源]:科学技术会议录索引(ISTP)
[文献类型]:科技会议
[标题]:Ultra-Shallow Junction Formation by Cluster Ion-Implantation
[作者]:J Matsuo;T Aoki;K Goto;T Sugii;I Yamada
[出版单位]:Materials Research SocietyWarrendale
[ISSN_ISBN]:1-55899-438-6
[会议名称]:Materials-Research-Society Symposium on Silicon Front-End Technology - Materials Processing and Modelling,San Francisco, CA,April 13-15, 1998
[来源]:SILICON FRONT-END TECHNOLOGY-MATERIALS PROCESSING AND MODELLING,pp 17-22
[系列名称]:MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS
[编辑者]:ENEB Cowern;DC Jacobson;PB Griffin;PA Packan;RP Webb
[主办单位]:Appl Mat;Avant Corp, TCAD Business Unit;Charles Evans & Assoc;Eaton Corp;Genus Inc;Mat Res Soc;Natl Electrostat Corp;Sematech;Varian
[地址]:J Matsuo,Kyoto_Univ, Ion Beam Engn Expt Lab, Kyoto 606, Japan
[专业领域]:Materials Science,Physics, Condensed Matter,Engineering, Electrical & Electronic
[唯一标识符]:CDSTIC.ISTP.184493
[文献来源]:科学技术会议录索引(ISTP)
[文献类型]:科技会议
[标题]:LOW HARDWARE COMPLEXITY PARALLEL TURBO DECODER ARCHITECTURE
[作者]:ZF WANG;YY TANG;Y WANG
[出版单位]:I E E ENEW YORK
[ISSN_ISBN]:0-7803-7761-3
[会议名称]:IEEE International Symposium on Circuits and Systems,BANGKOK, THAILAND,May 25-28, 2003
[来源]:IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS FOR VIDEO TECHNOLOGY;IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS;IEEE TRANSACTIONS ON SIGNAL PROCESSING;PROCEEDINGS OF THE 2003 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOL I - ANALOG CIRCUITS AND SIGNAL PROCESSING;PROCEEDINGS OF THE 2003 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOL II - COMMUNICATIONS-MULTIMEDIA SYSTEMS & APPLICATIONS;PROCEEDINGS OF THE 2003 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOL III - GENERAL & NONLINEAR CIRCUITS AND SYSTEMS;PROCEEDINGS OF THE 2003 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOL IV - DIGITAL SIGNAL PROCESSING-COMPUTER AIDED NETWORK DESIGN-ADVANCED TECHNOLOGY;PROCEEDINGS OF THE 2003 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOL V - BIO-MEDICAL CIRCUITS & SYSTEMS, VLSI SYSTEMS & APPLICATIONS, NEURAL NETWORKS & SYSTEMS,pp 53-56
[编辑者]:CIEEE
[主办单位]:IEEE Circuits & Syst Ssoc;Mahanakorn Univ Technol
[地址]:ZF WANG,NATL_SEMICOND_CO, INFORMAT APPLIANCE GRP, LONGMONT, CO 80501 USA
[专业领域]:ENGINEERING, ELECTRICAL & ELECTRONIC,COMPUTER SCIENCE, HARDWARE & ARCHITECTURE,IMAGING SCIENCE & PHOTOGRAPHIC TECHNOLOGY

版权声明:所有资料均为作者提供或网友推荐收集整理而来,仅供爱好者学习和研究使用,版权归原作者所有。
如本站内容有侵犯您的合法权益,请和我们取得联系,我们将立即改正或删除。
信息产业部备案号:京ICP备09025792号